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New Chip Material Expected to Lead Innovations (NewsFactor)
Tuesday, 15 April 2008
NewsFactor - IBM and its chip-alliance partners say a breakthrough chipmaking material known as "high-k/metal gate" has been thoroughly tested and is ready to roll on devices manufactured at IBM's 300-millimeter semiconductor plant in East Fishkill, N.Y. Chip designers will be able to use the new technology to realize performance and power savings advantages in their next-generation products, the partners said.
 
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